LENOVO THINKSYSTEM SR950 INTEL XEON PLATINUM 8176 28C 165W 2.1G PROC OP
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LENOVO THINKSYSTEM SR950 INTEL XEON PLATINUM 8176 28C 165W 2.1G PROC OP
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Socket
LGA 3647
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CPU cores
28
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CPU threads
56
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CPU family
Intel Xeon® Platinum
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TDP
165W
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CPU generation
- N/A -
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Description
Specifications
Xeon® Platinum 8176
38.5M Cache, 2.10 GHz
Specifications:
Essentials - Product Collection : Intel® Xeon® Scalable Processors
- Code Name : Products formerly Skylake
- Vertical Segment : Server
- Processor Number : 8176
- Lithography : 14 nm
CPU Specifications - # of Cores : 28
- # of Threads : 56
- Processor Base Frequency : 2.10 GHz
- Max Turbo Frequency : 3.80 GHz
- Cache : 38.5 MB L3 Cache
- # of UPI Links : 3
- TDP : 165 W
Memory Specifications - Max Memory Size (dependent on memory type) : 768 GB
- Memory Types : DDR4-2666
- Maximum Memory Speed : 2666 MHz
- Max # of Memory Channels : 6
- ECC Memory Supported : Yes
Expansion Options - Scalability : S8S
- PCI Express Revision : 3.0
- Max # of PCI Express Lanes : 48
Package Specifications - Sockets Supported : FCLGA3647
- TCASE : 89°C
- Package Size : 76.0mm x 56.5mm
Advanced Technologies - Intel® Optane™ Memory Supported : No
- Intel® Speed Shift Technology : Yes
- Intel® Turbo Boost Max Technology 3.0 : No
- Intel® Turbo Boost Technology : 2.0
- Intel vPro® Platform Eligibility : Yes
- Intel® Hyper-Threading Technology : Yes
- Intel® Virtualization Technology (VT-x) : Yes
- Intel® Virtualization Technology for Directed I/O (VT-d) : Yes
- Intel® VT-x with Extended Page Tables (EPT) : Yes
- Intel® Transactional Synchronization Extensions : Yes
- Intel® 64 : Yes
- Instruction Set Extensions : Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
- # of AVX-512 FMA Units : 2
- Enhanced Intel SpeedStep® Technology : Yes
- Intel® Volume Management Device (VMD) : Yes
Security & Reliability - Intel® AES New Instructions : Yes
- Intel® Trusted Execution Technology : Yes
- Execute Disable Bit : Yes
- Intel® Run Sure Technology : Yes
- Mode-based Execute Control (MBE) : Yes
Processor |
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Processor family | Intel® Xeon® Platinum |
Processor generation | 1st Generation Intel® Xeon® Scalable |
Processor model | 8176 |
Processor base frequency | 2.1 GHz |
Processor cores | 28 |
Processor socket | LGA 3647 (Socket P) |
Processor lithography | 14 nm |
Component for | Server/workstation |
Processor threads | 56 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.8 GHz |
Processor cache | 38.5 MB |
Processor cache type | L3 |
Thermal Design Power (TDP) | 165 W |
Processor codename | Skylake |
Memory |
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Maximum internal memory supported by processor | 768 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2666 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics |
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On-board graphics card | No |
Features |
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Market segment | Server |
Maximum number of PCI Express lanes | 48 |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | S8S |
Embedded options available | No |
Processor special features |
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Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel Trusted Execution Technology | Yes |
Intel® Speed Shift Technology | Yes |
Intel TSX-NI | Yes |
Intel 64 | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Conflict-Free processor | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Optane™ Memory Ready | No |
Intel® vPro™ Platform Eligibility | Yes |
Operational conditions |
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Tcase | 89 °C |
Logistics data |
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Harmonized System (HS) code | 85423119 |
Weight & dimensions |
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Processor package size | 76 x 56.5 mm |
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